The 5th Asian Thermal Spray Conference (ATSC 2012)
26-28, November, 2012, Tsukuba, Ibaraki, Japan
Scope of Conference
With great pleasure we announce that the 5th Asian thermal spray conference (ATSC 2012), which had been postponed due to an unparalleled large earthquake in
eastern Japan, will be held in Tsukuba, Japan on November 26-28, 2012. The purpose of this conference is to bring together state-of-the-art developments on all
aspects related to thermal spray in the Asia-Pacific region. This conference has been held in China, Korea, Singapore and Japan since 2005 and is expected to go to
countries such as India in the near future. The conference is intended to provide an attractive forum for presenting the latest advances in thermal spray by
researchers and engineers from industry, research laboratories, and academia. It is also expected to provide younger engineers and researchers in the region with
ample opportunities to learn about this fast-evolving technology, meet experts, and attain international experience.
Conference: 26-27, November, 2012
Tsukuba International Congress Center, Ibaraki, Japan
Banquet: 26, November
Excursion: 28, November
Organized by:
Japan Thermal Spray Society
Asian Thermal Spray Society
Sponsored by:
Japan Thermal Spray Association
TSUKUBA EXPO’85 MEMORIAL FOUNDATION
Tsukuba Tourist and Convention Association
Nippon Sheet Glass Fondation for Materials Science and Engineering
Supported by:
The Japan Institute of Metals
Japan Association of Corrosion Control
The Iron and Steel Institute of Japan
Japan Welding Society
The Japan Society of Mechanical Engineers
The Surface Finishing Society of Japan
The Ceramic Society of Japan
Smart Processing Society for Materials, Environment & Energy
National Institute for Materials Science (NIMS)
Special Rate Hotels for ATSC2012
Instructions for Presentation
The abstract submission has been closed.
The deadline for abstract submission has been extended to 9th July, 2012.
5, March, 2012: 2nd Announcement and Call for Papers
28, November, 2011: 1st Announcement and Call for Papers